![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/CMU2012H2.png\")
<\/p>\nFeatures & Application
\n\u2022 For noise suppression in super high speed signal lines: USB 3.x
\nHDMI 2.0, HDBaseT\u2122, DiplayPort, DVI, etc.; and in high speed
\ndifferential signal lines: USB 2.0, IEEE1394, LVDS, etc.
\n\u2022 Up to 6.0 GHz differential mode 3 dB cutoff frequency; up to
\n35 dB common mode noise attenuation in GHz range
\n\u2022 Lowest profile 0805 common mode choke \u2013 0.93 mm tall
\nCore material Ferrite ,with UV EXPOXY cover
\nEnvironmental RoHS compliant
\nTerminations Matte tin over nickel over silver-palladium-glass frit.
\n“Ambient temperature \u201340\u00b0C to +125\u00b0C with Irms current.”
\nMaximum part temperature 140\u00b0C
\nStorage temperature Component: \u201340\u00b0C to +140\u00b0C. Tape and reel packaging: \u201340\u00b0C to +80\u00b0C
\nResistance to soldering heat Max three 40 second reflows at
\n+260\u00b0C, parts cooled to room temperature between cycles
\n“Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30\u00b0C \/ 85% relative humidity)”<\/p>\n
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![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/CMU2012H3.png\")
<\/p>\n
Impedance\/Inductance\/Q\/ LCR Angilent E4991A
\nResistance DC Chroma 16502
\nCurrent per winding that causes a 20\u00b0C rise from 25\u00b0C ambient
\nElectrical specifications at 25\u00b0C<\/p>\n
Weight 7.9 \u2013 10 mg.
\nPackaging 2000\/7\u2033 reel; Plastic tape: 8 mm wide.
\nPackaging will different,accroding the various chip size.<\/p>\n
Typical Impedance vs Frequency <\/strong> Lead-free the recommended reflow condition
\nCommon Mode & Differential mode<\/strong>
\n![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/CMU2012H4.png\")
\nGENERAL CHARACTERISTICS
\n1. Operating temperature range: -40 TO + 125\u2103(Includes temperature when the coil is heated)
\n2. External appearance: On visual inspection, the coil has no external defects.
\n3. Terminal strength: After soldering. Between copper plate and terminals of coil. Push in two directions of X.Ywithstanding at below conditions. Terminal should not peel off. (refer to figure at right) 0.5kg Min \u20132012
\n4. Insulating resistance: Over 100M\u2126 at 100V D.C. between coil and core
\n5. Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core
\n6. Temperature characteristics: Inductance coefficient (0~2,000)x10-6\/ ( \u2103 -25~+80 ). \u2103 , inductance deviation within\u00b15.0%, after 96 hours.
\n7. Humidity characteristics(Moisture Resistance): Inductance deviation within \u00b15%, after 96 hours in 90~95% relative humidity at 40 \u00b12 and 1 hour drying under normal condition.
\n8. Vibration resistance: Inductance deviation within \u00b15%, after vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes.
\n9. Shock resistance: Inductance deviation within \u00b15%, after being dropped once with 981m\/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations.
\n10. Resistance to Soldering Heat: 260 , 10 seconds(See attached recommend reflow)
\n11. Storage environment: Storage condition: Temperature Range: 10 ~ 35 (Generally: 21 ~ 31 ) , Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%) ; Transportation condition: Temperature Range:-35 ~ 85 , Humidity Range: 50% ~ 95% RH
\n12. Use components within 12 months. If 12 months or more have elapsed, check soldarability before use.
\n13. Reflow profile recommend:
\nLead-free heat en duran ce test<\/p>\n![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/CMU2012H5.png\")
<\/p>\n
\n![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/CMU2012H6.png\")
<\/p>\n","protected":false},"excerpt":{"rendered":"