![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/LTF53352.png\")
<\/p>\nFeatures & Application
\n\u2022 IEEE 802.3 Ethernet compatible
\n\u2022 Discrete transformers and common mode chokes for flexible PCB layout
\n\u2022 Pair with common mode choke CMC2012F801-0.28AT for EMI reduction
\n\u2022 Expanded temperature range: -40 to +85 \u00b0C
\n\u2022 Environmental RoHS compliant, halogen free
\n\u2022 Low profile 5335 footprint: 5.30\u00d7 3.50 \u00d7 3.40 mm
\nCore material Ferrite<\/p>\n
Terminations RoHS compliant matte tin over nickel over silver palladium-glass frit.
\nAmbient temperature \u201340\u00b0C to +85\u00b0C with Irms current.
\nMaximum Part Temperature +125\u00b0C
\nStorage temperature Component: \u201340\u00b0C to +85\u00b0C. Tape and reel packaging: \u201340\u00b0C to +80\u00b0C
\nResistance to soldering heat Max three 40 second reflows at +260\u00b0C, parts cooled to room temperature between cycles
\n” Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30\u00b0C \/85% relative humidity)
\n85% relative humidity)”<\/p>\n
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![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/LTF53353.png\")
<\/p>\n
Inserion Return Loss LCR Angilent E5071C\/E5071B
\nInductance\/Cp Angilent E4991A
\nCurrent per winding that causes a 20\u00b0C rise from 25\u00b0C ambient
\nElectrical specifications at 25\u00b0C<\/p>\n
Weight 155 \u2013 175 mg.
\nPackaging 500\/7\u2033 reel; Plastic tape: 12 mm wide.
\n“Packaging will different,accroding the various chip size. ”<\/p>\n
GENERAL CHARACTERISTICS<\/strong> Lead-free the recommended reflow condition<\/p>\n
\n1. Operating temperature range: -40 TO + 125\u2103(Includes temperature when the coil is heated)
\n2. External appearance: On visual inspection, the coil has no external defects.
\n3. Terminal strength: After soldering. Between copper plate and terminals of coil. Push in two directions of X.Ywithstanding at below conditions.
\nTerminal should not peel off. (refer to figure at right) 0.98kg Min \u20135335
\n4. Insulating resistance: Over 100M\u2126 at 100V D.C. between coil and core
\n5. Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core
\n6. Temperature characteristics: Inductance coefficient (0~2,000)x10-6\/ ( \u2103 -25~+80 ). \u2103 , inductance deviation within\u00b15.0%, after 96 hours.
\n7. Humidity characteristics(Moisture Resistance): Inductance deviation within \u00b15%, after 96 hours in 90~95% relative humidity at 40 \u00b12 and 1 hour drying under normal condition.
\n8. Vibration resistance: Inductance deviation within \u00b15%, after vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes.
\n9. Shock resistance: Inductance deviation within \u00b15%, after being dropped once with 981m\/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations.
\n10. Resistance to Soldering Heat: 260 , 10 seconds(See attached recommend reflow)
\n11. Storage environment: Storage condition: Temperature Range: 10 ~ 35 (Generally: 21 ~ 31 ) , Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%) ; Transportation condition: Temperature Range:-35 ~ 85 , Humidity Range: 50% ~ 95% RH
\n12. Use components within 12 months. If 12 months or more have elapsed, check soldarability before use.
\n13. Reflow profile recommend:
\nLead-free heat en duran ce test<\/p>\n![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/LTF53354.png\")
<\/p>\n![\"\"](\"https:\/\/www.bing-ri.com\/wp-content\/uploads\/LTF53355.png\")
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